摘要
在电化学沉积金中添加微量的硬化剂钴或镍得到的硬化金通常具有较好的硬度、耐腐蚀性和耐磨性。硬化金被广泛应用为接触材料。介绍了对硬化金的电镀过程以及相应的镀层性质的研究。重点介绍了金的电化学还原机理、硬化剂的作用原理以及孔隙的形成和降低方法。最后介绍了新的电镀工艺和新合金以得到较小的孔隙率,从而可以减少金的用量,而不用牺牲其机械、电气和抗腐蚀性能。
Electrochemical plated gold,with addition of small amount of cobalt or nickel as hardening agent,is applied as a contact material for electrical connectors due to its superior hardness,good corrosion and wear resistances.In this paper,the deposition processing and properties of electrodeposited hard gold layer was firstly introduced.And then the reduction mechanism of gold,role of hardening agents,formation and depression of micropores were discussed.Finally,a new electroplating technique and a new gold alloy were pointed out to reduce the gold usage and layer porosity but without sacrificing its mechanical,electrical and anticorrosion performances.
出处
《电镀与精饰》
CAS
北大核心
2011年第7期13-17,46,共6页
Plating & Finishing
关键词
电化学沉积
硬化金
反向脉冲电镀
孔隙率
electrochemical deposition
hard gold
reverse pulsed plating
porosity
