摘要
研究了普通镀钴溶液中碳化硅微粒与基质金属钴形成复合镀层的电沉积过程．结果表明，在小的微粒载荷量下，复合电沉积过程由微粒向阴极的传输所控制．而在大的微粒载荷量下，小电流密度时复合电沉积过程由微粒的强吸附所控制，大电流密度时复合电沉积过程由微粒向阴极的传输所控制．
Codeposition process of particles SiC with matrix metal Co from Co plating bath was studied. The experimental results show that the composite electrodeposition is controlled by the transfer of particles to the cathode when the dispersion amount is small. With large amount dispersion, the codeposition is first controlled by the strong adsorption of particles on the cathode at low current density and at high current density it is again controlled by the transfer of particles to the cathode.
关键词
复合电沉积
钴
碳化硅
镀钴
复合镀层
电沉积
composite plating
codeposition amount
dispersion amount
cathodic current density
