铜基材乙醇体系浸镀银工艺的研究

Technology of Immersion Silver Plating onto Copper Substrate in Ethanol-Based Solution System

为解决传统水相体系浸镀银所存在的问题,笔者采用乙醇溶液体系,以硝酸银为主盐,乙二胺为络合剂,并就银离子浓度、络合剂与银离子摩尔浓度比以及镀液pH值等工艺参数,对紫铜浸镀银镀层性能的影响进行了研究。试验结果表明:当银离子质量浓度为2.0 g/L,络合剂与银离子摩尔浓度比为4∶1,镀液pH值为9.8,温度为室温时,可以在紫铜表面获得外观光亮、均匀致密且与基材结合良好的银镀层。

Ethanol-based solution system was adopted to solve the problem of traditional immersion silver planting in aqueous system, silver nitrate and ethylenediamine was employed as main salt and complexant respectively. Silver ion concentration, molar ratio of complexant and silver ion and the pH value of the solution which could affect the film properties on immersion silver planting onto red copper were investigated. The results show that the silver coating on the red copper surface is obtained at silver ion concentration 2.0 g/L, molar ratio of complexant and silver ion 4 ： 1, the pH value 9.8 and room temperature, of which has bright, smooth and dense appearance and integrated well with the matrix.