摘要
制备了含不同Bi,P元素的(Sn-9Zn0.05Ce)xBi和(Sn-9Zn0.05Ce)xP钎料合金,观察并分析了钎料的显微组织形貌,测试了钎料的抗拉强度、断后伸长率以及维氏硬度.结果表明,添加Bi元素能显著提高Sn-9Zn0.05Ce钎料合金的抗拉强度和硬度,但同时会明显降低其断后伸长率,而添加微量P元素对钎料的抗拉强度与硬度没有明显的影响.此外,添加Bi和P元素均能促使钎料析出针状或颗粒状富锌相,富锌相随Bi或P元素添加量的增加而增多,并因此影响钎料合金的力学性能.
The Sn-9Zn0.05Ce lead-free solder with Bi and P additions were prepared,and microstructure,tensile strength,elongation and Vickers hardness of the lead-free solders were studied.Experimental results show that the tensile strength and hardness increase with more Bi addition in Sn-9Zn0.05Ce lead-free solder,while the elongation decreases with Bi addition.P addition in Sn-9Zn0.05Ce lead-free solder does not obviously affect the tensile strength and hardness.In addition,either Bi or P addition in Sn-9Zn0.05Ce lead-free solder would make Zn separate out from Sn-9Zn0.05Ce lead-free solder more easily,and needle-like or grain-like Zn-rich phase can be found in the solder.Moreover,Zn-rich phase increases with more Bi or P additions in the solder,and accordingly has a great effect on the mechanical properties of Sn-9Zn0.05Ce solder.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2011年第7期17-20,114,共4页
Transactions of The China Welding Institution
基金
重庆市重点自然科学基金资助项目(2006BA4034)
重庆科技学院校内科研基金项目(CK2010B23)
关键词
锡-锌钎料
显微组织
抗拉强度
硬度
Sn-Zn0.05Ce solder
microstructure
tensile strength
hardness
