3HSU T R. MEMS and microsystems-design and manufacture [M]. Boston:Mcgraw-Hill, 2002.
4BARRON C C, COMTOIS J H, MICHALICEK M A. Electrothermal actuators fabricated in four-level planarized surface mieromachined polycrystalline silicon [J]. Sensors and Actuators: A, 1998, 70 (1/2): 23-31.
5BALTES H, BRAND O. CMOS-based microsensors and packaging [J]. Sens Actuator: A, 200I, 92 (1/2/3): 1-9.
6PREMACHANDRAN C S, MOHANRAJ R N S, CHONG SER CHOONG IYER M K. A vertical wafer level packaging using through hole filled via by liftoff polymer method for MEMS and 3D stack application [C] // Proceeding of 55^th ECTC. Las Vegas, USA, 2005: 1094- 1098.
7WAGNER M. Method for creating low cost 3D MEMS chemical sensors by using through wafer via and wafer bonding [C] // Proceeding of 57^th ECTC. Reno, NV, USA, 2007: 1119- 1126.
8GOOCH R. Wafer level vacuum packaging for MEMS [J]. Journal of Vacuum Science and Technology: A, 1999, 17 (4) : 2295 - 2299.
