摘要
介绍了一种新的不含游离氰的镀金盐以及相关的无氰化学沉金工艺,无氰化学沉金工艺沉金金面的均匀性高,可减少黑焊盘(PAD)的产生机率,工艺过程更环保,生产技术成熟,管理措施齐全,金盐供应充足,对不同客户的适应性强。无氰化学沉金工艺已引起PCB同行的高度关注。
Describe a new cyanide-free immersion gold process.It is of high uniformity and less probability of black-pad for the deposited gold surface when it is compared with that of the traditional immersion gold process.The technology is a competitive alternative for the traditional process with cyanide,because it can meet both the environmental requirements and the related technical index of the modern immersion gold process.
出处
《电子工艺技术》
2011年第4期189-192,216,共5页
Electronics Process Technology
基金
国家自然科学基金项目(项目编号:2097620)
湖南省自然科学基金项目(项目编号:07JJ6156)
关键词
无氰金盐
无氰沉金工艺
黑焊盘
Non-cyanide Aurous Salt
Cyanide-free immersion gold process
Black-pad
