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SMT生产线制程工艺控制细则 被引量:2

SMT Production Line Manufacturing Process Control Rules
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摘要 从符合RoHS指令及无铅产品可靠性方面考虑,EMS企业最好把无铅制程与有铅制程划分区域、分线进行,但由于资金缺少或有铅产品还占有很大市场份额等种种原因,部分中小型EMS企业不得不采用无铅有铅制程共线的方案。在这种复杂的情况下,为防止有铅产品及其材料对无铅产品造成污染,必须要严格对无铅产品生产过程中的各个工序进行有效控制,尤其是有铅制程向无铅制程切换的过程,确保生产出合格的无铅产品。从制程类型及物料辅料控制、制程切换工艺控制及无铅制程关键工艺控制三个方面做了详细的论述。 Lead-free product must meet the ROHS directive and reliability,so EMS company should have lead-free process area and lead process area respectively in the factory,but some small and medium size EMS companies have to use lead-free and lead processes on one line due to fund shortage or lead products also account for a large market share and various reasons.In this complex situation,in order to prevent contamination risk of lead-free products from lead products,lead-free products must be strictly controlled during each process,in particular switching from lead process to lead-free process.Introduce process control of types,control of materials,process control switching from lead process to lead-free process and key process control of lead-free manufacturing.
出处 《电子工艺技术》 2011年第4期210-211,226,共3页 Electronics Process Technology
关键词 无铅制程 有铅制程 工艺控制 Lead-free process Lead process Process control
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  • 1顾霭云,赵东明,曹白杨.从有铅向无铅焊接过渡阶段应注意的问题[J].华北航天工业学院学报,2005,15(3):1-5. 被引量:13
  • 2史建卫,王乐,徐波,王洪平.无铅制程导入面临的问题及解决方案(续)[J].电子工业专用设备,2006,35(6):36-46. 被引量:3
  • 3张彬彬,王春青.冷却速率对无铅钎料和焊点质量影响[J].电子工艺技术,2007,28(2):71-73. 被引量:4
  • 4Thomas A.Anderson.电子元件的引脚无铅电镀镀层分析及减少锡毛刺的方法[EB/OL].http://www.guang-dongdz.com/special-column/techarticle/20064/211005538804.html,2009.12.
  • 5顾霭云.过渡阶段有铅和无铅混用需要注意的问题和应对措施[EB/OL].http://www.chinaem.com.cn/bencandy.php?rid:38&id:2807.2009.12.
  • 6徐欣.无铅技术现状及过渡阶段应注意的问题[EB/OL].http://www.newsmt.com/news/shownews.asp?newsid=9029,2009.12.
  • 7杨光育,徐欣,董义等.无铅合金与锡铅合金性能对比分.
  • 8Bob Willis. Secondary reflow - another lead - free defect [ EB ]. http ://www. leadfreesoldering. com.
  • 9Qiang Hu,Zhong - suo Lee, Zhi - li Zhao et al. Study of cooling rate on lead - free soldering microstructure of Sn -3.0Ag -0.5Cu solder[ C ]. 2005 international IEEE conference on asian green electronics, shanghai China, 2005:156 - 160.
  • 10.Acceptability of Electronic Assemblies[].IPC-A-D.2004

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