树脂基复合材料固化过程中温度场的数值模拟

Numerical Modeling of Temperature Field in Curing Process of Thermosetting Resin Matrix Composite Materials

树脂基复合材料的热固化成型是一个力、热与化学反应相互耦合的过程。文中就其热固化过程中温度场分布的数学模型进行了研究,在此基础上利用有限元方法并结合OOP(Objectoriented program m ing)技术实现了对复合材料固化过程中温度场的数值模拟,讨论了板厚、升温率等因素对温度分布的影响。计算结果表明,固化过程的升温速率应根据复合材料层板的厚度加以合理地选择。

The curing process of thermosetting resin matrix composite materials involves complex mechanical, thermal and chemical reactions. In this paper, a mathematical model describing the curing temperature field is established and is used to simulate the temperature distribution in the curing process of thermosetting resin matrix composite laminated plates by means of the finite element methods and OOP (object oriented programming) technique. The influence of the plate thickness and the rate of temperature rise on the temperature distribution are discussed. The results indicate that the rate of temperature rise in the curing process should be suitably selected according to the thickness of composite laminated plates so as to ensure uniform distribution of the temperature field.