摘要
研究了593固化剂不同用量加入电子封装用环氧树脂E—51中的效果,以及在E—51/Al2O3复合材料中硅烷偶联剂不同用量的效果。结果显示:593固化剂与环氧树脂质量比为1:4时,复合材料的致密度高,气孔少,成型效果好;当硅烷偶联剂KH—560质量分数为8%时,复合材料的热导率达到0.75 W/(m.K)。
The effect of different amounts of 593 curing agent on epoxy resin E—51 and silane coupling agent on epoxy resin E—51/Al2O3 composites were studied through experiments.The results show that composites have higher density,less pores and better forming effect when the mass ratio of 593 curing agent and epoxy resin is 1：4.Thermal conductivity of the composite reaches 0.75 W/（m？K） as the mass fraction of KH—560 is 8%.
出处
《电子元件与材料》
CAS
CSCD
北大核心
2011年第8期48-51,共4页
Electronic Components And Materials
关键词
电子封装
环氧树脂
复合材料
electronic packaging
epoxy resin
composites
