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Hydrogen bonding in hydrogenated amorphous silicon thin films prepared at different precursor gas temperatures with undiluted silane 被引量:4

Hydrogen bonding in hydrogenated amorphous silicon thin films prepared at different precursor gas temperatures with undiluted silane
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摘要 Hydrogen bonding configurations and hydrogen content in hydrogenated amorphous silicon (a-Si:H) thin films prepared at different precursor gas temperatures with undiluted silane have been investigated by means of Fourier transform infrared (FTIR) spectroscopy.The results show that the gas temperature before precursor gases entering the glow-discharge zone re-markably influences the hydrogen bonding configurations and the hydrogen content in a-Si:H thin films.The hydrogen content decreases from 18% down to 11% when increasing the gas temperature from room temperature (RT) to 433 K.Meanwhile,the clustered hydrogen at the physical film surface or at the internal surfaces of the microvoids decreases,indicating that a-Si:H thin films are densified at higher precursor gas temperatures.For a-Si:H thin films deposited at gas temperature of 433 K,the isolated silicon-hydrogen bonding configuration is predominant in the testing films. Hydrogen bonding configurations and hydrogen content in hydrogenated amorphous silicon (a-Si:H) thin films prepared at different precursor gas temperatures with undiluted silane have been investigated by means of Fourier transform infrared (FTIR) spectroscopy. The results show that the gas temperature before precursor gases entering the glow-discharge zone re markably influences the hydrogen bonding configurations and the hydrogen content in a-Si:H thin films. The hydrogen content decreases from 18% down to 11% when increasing the gas temperature from room temperature (RT) to 433 K. Meanwhile, the clustered hydrogen at the physical film surface or at the internal surfaces of the microvoids decreases, indicating that a-Si:H thin films are densified at higher precursor gas temperatures. For a-Si:H thin films deposited at gas temperature of 433 K, the isolated silicon-hydrogen bonding configuration is predominant in the testing films.
出处 《Science China(Technological Sciences)》 SCIE EI CAS 2011年第9期2310-2314,共5页 中国科学(技术科学英文版)
基金 supported by the Ministry of Education of People’s Republic of China (Grant No. J2009JBPY003)
关键词 氢化非晶硅薄膜 气体温度 化学 硅烷 稀释 傅里叶变换红外光谱 粘接 氢含量 a-Si:H thin film gas temperature hydrogen bonding FTIR PECVD
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参考文献29

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