摘要
建立了SMA 薄膜/基片的耦合数学模型,对溅射在基片上的SMA 薄膜产生驱动的过程进行了仿真模拟,结果表明SMA 薄膜/ 基片的耦合驱动是双金属效应和形状记忆效应的双重结果,该驱动力比单纯双金属效应产生的驱动力大得多。该模型对于实际应用SMA 薄膜/基片结构进行微驱动的器件设计具有理论指导意义。
Mathematical model and simulation for the driving process of the coupled structure by sputtering shape memory alloy thin films on Si substrates are proposed.The results show that the driving stress is due to bi metal effect and shape memory effect simultaneously and it is much larger than that caused only by bi metal effect.This model is very useful for designing and simulating SMA/Si microactuators.
出处
《微细加工技术》
1999年第4期38-46,共9页
Microfabrication Technology