摘要
精磨玻璃表面的破坏层由凹凸层和裂纹层组成。凹凸层和裂纹层的空间特性,直接影响其后的抛光效率。测量破坏层深度,为选用适当的方法精磨和抛光,使加工工艺最优化,提供了依据。测量精磨玻璃表面破坏层深度可以用光束扫描探测法,也可以用抛光测试法和电子显微镜观测法等。光束扫描探测法适用于实验室,抛光测试法适用于车间,而电子显微镜法仅适用于科研单位和高等院校。
This paper reviews methods for testing failure depth on fine ground glasssurface. Failure structure of a surface layer consists of relief layer and Cracklayer, the dimensional characteristics of which influence directly the subsequentpolishing results. Testing the failure depth is basic to the choice of a proper finegrinding and polishing method, and hence to optimize glass surface processing. Three methods are generally adopted in testing failure depth on fine groundsurface, namely light beam scanning detection, try and polishing method, andinspection by means of electronic microscope. The light beam scanning detectingmethod is used in loboratories, try and polishing method is used in workshops,and inspection by means of electronmicroscope is used in research institutions anduniversities.
出处
《光学技术》
CAS
CSCD
1989年第5期42-47,共6页
Optical Technique