期刊文献+

光电互联技术及其发展 被引量:4

Summary of photoelectric interconnection technology
下载PDF
导出
摘要 概述了光电互联的概念、特点、基本原理和基本方式,以及器件与模块光电互联、印制板之间光电互联、整机级光电互联等光电互联基本工艺技术,介绍了波导互联方式、自由空间互联方式等光电互联的主要技术及其研究与发展状况,并分析了光电互联技术发展中存在的问题。 The concept of photoelectric interconnection,its characteristics and basic principles are summarized in this paper.Then the main process technologies of photoelectric interconnections between devices and modules,between PCBs and between electronic equipments,are concluded.The main technologies of these photoelectric interconnections,such as waveguide interconnection,free-space interconnection etc,and its research and development status also are introduced.Finally,the existing problems of photoelectric interconnection development are analyzed.
出处 《桂林电子科技大学学报》 2011年第4期259-265,共7页 Journal of Guilin University of Electronic Technology
基金 总装预研项目
关键词 光电互联技术 器件 印制板 photoelectric interconnection technology device printed board
  • 相关文献

参考文献8

  • 1陈正浩.电气互联技术的现状及发展趋势[J].电讯技术,2007,47(6):12-18. 被引量:6
  • 2CHO S Y, SEO S W, JOKERST N M, et al. Board-level opti- cal interconnection and signal distribution using embeddedthin- film optoelectronic devices[J]. J Lightw Technol, 2004,24 (3) : 2111-2118.
  • 3Huang Zhaoran,GUIDOTTl D R. Hybrid integration of end-to-end optical interconnects on printed circuit boards[J]. IEEE Transactions on Components and Packaging Technologies, 2007,12(4) : 1-4.
  • 4MATSUBARA TAKAHIRO, ODA KEIKO, WATANABE KEIICHIRO, et al. Three dimensional optical interconnect on organic circuit boardEJ]. Electronic Components and Technolo- gy Conference, 2006,12 (2) : 789-793.
  • 5HOLMSTROM S,YALCINKAYA A D, ISIKMAN S. FR-4 as a new MOEMS platform, optical MEMS and nanophotonics[J~. 2007 IEEE/LEOS International Conference on, 2007,12 (3) : 25- 26.
  • 6TAKAHARA HIDEYUKI. Optoelectronic multiehip module packaging technologies and optical input/output interface chip- level packages for the next generation of hardware systems[J]. IEEE Journal of Selected Topics in Quantum Electronics, 2003,9(2) :443-451.
  • 7OGUNSOLA O. Chip-level waveguide-mirror-pillar optical in- terconnect structure[J]. IEEE Photonics Technology Letters, 2006,18(15) : 1672-1674.
  • 8JIN Tae Kim, JUNG Jin Ju, PARK S, et al. O/E integration of polymer waveguide devices by using replication technology[J]. IEEE Journal of Seleeted Topics in Quantum Electronics, 2007, 13(2) : 177-182.

二级参考文献2

共引文献5

同被引文献18

引证文献4

二级引证文献5

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部