摘要
目的:探讨半导体激光局部照射治疗压疮的疗效。方法:将47例压疮患者随机分为治疗组(24例)和对照组(23例)。两组患者在常规治疗基础上,治疗组加用半导体激光局部照射压疮。结果:治疗组压疮治愈率为75.51%、总有效率为89.80%,对照组分别为31.91%、68.09%,两组比较,差异有高度统计学意义(P<0.01),治疗组各期压疮治愈率及压疮愈合时间均优于同期对照组,两组比较,差异有统计学意义(P<0.05或P<0.01)。结论:半导体激光治疗压疮效果显著。
Objective： To explore the curative effect on pressure sores treated by local semiconductor laser irradiation. Methods： 47 cases of patients with pressure sores were randomly divided into treatment group （24 cases treated with semi- conductor laser and drug） and control group （23 cases treated with drug only）. Results： In the treatment group, the cure rate was 75.51% and the total effective rate was 89.80%. In the control group, the cure rate was 31.91% and the total ef- fective rate was 68.09%. These differences had highly statistical significance between the two groups （P〈0.01）. The cure rate and healing time of each grade pressure sores in the treatment group were better than those of the control group （P〈 0.05 or P〈0.01）. Conclusion： The curative effect of the treatment of pressure sores by semiconductor laser irradiation is remarkable.
出处
《中国医药导报》
CAS
2011年第23期43-44,共2页
China Medical Herald
关键词
半导体激光
压疮
疗效
Semiconductor laser
Pressure Sores
Curative effect
