低温瓷粉、高温瓷粉与钴铬烤瓷合金结合强度的实验研究

Comparative evaluation of bond strength between low fusing porcelain with cobalt-chromium alloys and high fusing porcelain with cobalt-chromium alloys

目的:观察IPS d.SIGN低温瓷粉、IPS Classic高温瓷粉与WirobondC钴铬合金的金瓷结合强度及结合界面的微观形貌。方法:制作低温瓷粉、高温瓷粉与钴铬合金的金瓷结合试件各10个,其中8个进行三点弯曲测试,2个包埋打磨后用扫描电镜观察界面。结果:低温瓷粉组、高温瓷粉组的金瓷结合强度值分别是(29.82±5.37)MPa、(39.20±4.68)MPa(P<0.05),均显著大于ISO9693要求的25 MPa。扫描电镜下可见低温瓷粉组比高温瓷粉组金瓷结合较为疏松,界面气泡略多,且大小差异更明显。结论:IPS d.SIGN低温瓷粉和IPS Classic高温瓷粉均可与WirobondC钴铬烤瓷合金匹配使用。

Objective： To evaluate the bond strength of IPS d.SIGN low fusing porcelain and IPS Classic high fusing porcelain fussed to Wirobond C New Formula Cobalt-chrome metal-to-ceramic alloy respectively.Methods： Low fusing porcelain and high fusing porcelain was fused to the Cobalt-Chromium alloys strips respectively according to ISO9693（n=10/group）.8 specimens of each group were submitted to three point bending test,the other two were observed by SEM.Results： The bond strength（MPa） of low fusing porcelain group and high fusing porcelain group was 29.82±5.37 and 39.20±4.68 respectively（P0.05）,both were higher than 25 MPa required by ISO9693.SEM observation showed that IPS Classic and Wirobond C Cobalt-chrome alloy combined together closely without cracks.Scattered bubbles with diameter of 2-4 μm,casually with diameter of 5-6 μm could be observed.The combination of IPS d.SIGN with the alloy was a little looser than that of IPS classic.The bubbles was a little more than those in the IPS Classic group.And the diameter varied from 2,3 μm to 10 μm.Conclusion： Both IPS d.SIGN low fusing porcelain and IPS Classic high fusing porcelain can match with Wirobond C New Formula Cobalt-chrome metal-to-ceramic alloy.