环氧热熔胶的合成及其在可粘合PTFE上的应用

Synthesis of Epoxy Hot-Melt Adhesive and Application for Bondable PTFE

采用环氧树脂E-20、均苯四甲酸二酐、DMP-30合成高温快速固化环氧热熔胶粘剂,实验结果表明:E20/PMDA摩尔比为4.1/1,DMP-30用量为0.3%～0.5%,在110～120℃反应5～6 h制得的环氧热熔胶对经过钠/萘腐蚀液处理后的聚四氟乙烯(PTFE)进行涂覆,得到可粘合PTFE板,于205℃固化90 s,与钢板粘接的剪切强度达2.129 MPa,在275.5℃下无热重损失,该胶固化迅速,粘接性和耐热性良好。

PMDA/Epoxy hot melt adhesive was compounded by Epoxy resin E-20,Pyromellitic dianhyride and DMP-30, the results showed that with the gram molecule proportion of E20/PMDA for 4. 1/1 ,the percentage of DMP-30 for 5 % , the reaction temperature for 110 -120 ℃ ,the reaction time for 5 -6 h, epoxy melt adhesive was obtained. Bondable PTFE sheet which was processed by the corrosive of sodium/naphthalene/tetrahydrofuran could be manufactured by coating with the epoxy melt adhesive above,cured under 205 ℃ for 90 s,the shear strength joint with steel plate could be reached 2. 129 MPa,none weight at the temperature of 275.5 ℃ to lose. This adhesive was cured quickly and had better strength, as well as better thermal stability.