加成型阻燃导热有机硅电子灌封胶的研制

Development of flame-retardant and heat conductive silicone encapsulant

以乙烯基硅油、含氢硅油为基料,铂络合物为催化剂制得双组分加成型有机硅灌封胶。通过添加导热和阻燃填料提高灌封胶的导热性和阻燃性,加入增粘剂改善有机硅的粘接性能。结果表明,100份乙烯基硅油(乙烯基质量分数1%)中含氢硅油(活性氢质量分数0.18%)15份、铂含量10×10-6、导热填料40份、阻燃剂含量50×10-6、增粘剂1份,所得灌封胶具有较好的综合性能,能够满足大功率电子元器件的灌封要求。

The two component addition-type silicone encapsulant was prepared from vinyl silicone oil, hydrosilicone oil and platinum （pt） complex catalyst in this study. The heat conductivity and flame retardance were improved by adding the heat conductive or flame retardant fillers. The adhesion properties were also improved by using coupling agent. The proper formulation was as follows： vinyl silicone oil （vinyl content 1 wt%） 100pbw, hydrogen containing silicon oil（active hydrogen content 0.18 wt%） 15pbw, platinum catalyst 10 ppm, heat conductive filler 40pbw, flame retardant 50ppm and coupling agent lpbw. The encapsulant obtained by this formulation possessed excellent comprehensive properties.