摘要
介绍了电磁环境的组成,引出电磁兼容问题产生的原因,然后提出印制板的电磁兼容设计要求,为了达到这些要求,从元器件的布置、地线和电源线的布置、信号线的布置3个方面详细介绍了印制板的设计方法。
describes the electromagnetic environment of the composition,leds to the cause of the problem of electromagnetic compatibility;Then,we propoased EMC PCB design requirements,in order to meet these requirements,from components of the arrangement,the arrangement of ground and power lines,signal lines of the arrangement described in detail three aspects of PCB design.
出处
《装备制造技术》
2011年第8期172-173,共2页
Equipment Manufacturing Technology
关键词
印制板级
电磁兼容性
阻抗匹配
PCB level
electromagnetic compatibility
impedance matching