回收废弃印刷电路板焊锡的新技术

A new technology for recycling solder from waste printed circuit boards

提出一种回收废弃印刷电路板焊锡的有效方法。其步骤为:在整个回收过程中不会对环境造成二次污染:用油加热废弃印刷电路板至焊锡熔化,在离心力的作用下将焊锡分离和回收。实验结果表明:当油温为240℃,转鼓转速为1 400 r/min,采用间歇式的方式旋转6 min,废弃印刷电路板焊锡即可回收完全。

An effective technology without a negative impact on the environment for recycling solder from WPCBs was investigated.The procedures were as follows： WPCBs were heated by immersing in the oil,and the molten solder of WPCBs was separated and recovered by the centrifugal force.The results show that solder is effectively separated from WPCBs when the oil temperature is 240 ℃,and the rotating drum is rotated for 6 min intermittently with a rotational speed of 1 400 r/min.