TC4合金TLP扩散焊的组织与性能

The Microstructure and Properties of TLP Diffusion Bonding Joints of TC4 Alloys

采用ＢＴｉ３５ＺｒＣｕＮｉ非晶箔中间层合金对ＴＣ４ 钛合金进行了瞬间液相扩散焊 （ＴＬＰ）， 对接头的组织和性能、元素分布情况进行了测试分析。结果表明， 在合适的规范下所得 ＴＬＰ接头组织为网蓝组织， 强度达 ９０７ＭＰａ， 断口分析表明， 接头具有较好的韧性。

Ti 6Al 4V alloy was bonded by TLP method using BTi35ZrCuNi amorphous foil as the interlayer alloy The microstructures and properties, as well as the element distribution of the joints were examined The results show that lamellar structure is formed in the bonding seam under suitable conditions, and the corresponding tensile strength of the joints reaches 907 MPa The joints also exhibit good toughness