摘要
用Ｔｉ箔在１ ３２３ Ｋ 进行Ｓｉ３Ｎ４ 与Ｎｉ之间的连接，并对连接界面区的微观形貌、成分分布和界面反应产物进行了分析研究． 结果表明：通过Ｎｉ与Ｔｉ之间的相互扩散，在Ｓｉ３Ｎ４ 表面形成浸润良好的Ｔｉ－Ｎｉ液体合金，实测Ｔｉ－２８Ｎｉ共晶合金１ ３２３ Ｋ 时在Ｓｉ３Ｎ４ 表面的浸润角为９°． 基于ＥＤＸ，ＸＲＤ 测定结果和热力学分析，确定界面结构为：Ｓｉ３Ｎ４／ＴｉＮ（反应层Ⅰ）／Ｔｉ５Ｓｉ３＋ Ｔｉ５Ｓｉ４＋ Ｎｉ３Ｓｉ（反应层Ⅱ）／Ｎｉ－Ｔｉ化合物层／Ｎｉ固溶体／Ｎｉ． 反应层Ⅰ和反应层Ⅱ均随连接时间的增加而增厚，但反应层Ⅱ的成长速率和厚度明显高于反应层Ⅰ． 这种界面结构形式在０．９～７．２ ｋｓ 的连接时间范围内始终没有发生变化．
Bonding of Si\-3N\-4 to Ni with Ti foil was performed at 1 323 K. The interface microstructures, composition distribution and the reaction products were observed and investigated by SEM, EDX and XRD analyses, respectively. It was shown that through the interdiffusion of Ti and Ni, Ti\|Ni liquid alloy, which had excellent wetting power, was formed on the surface of Si\-3N\-4, wetting angle was 9° for Ti\|28Ni eutectic liquid alloy on Si\-3N\-4 surface. It was comfirmed that interfacial structure with a transition layer of Si\-3N\-4/TiN(reaction layer Ⅰ)/Ti\-5Si\-3+Ti\-5Si\-4+Ni\-3Si(reaction layer Ⅱ)/Ni\|Ti compound/Ni solid solution/Ni was formed, based on EDX and XRD analytic results, and from the point of thermodynamics. The thickness of reaction layer Ⅰ and Ⅱ increased with increasing bonding time, however, the thickness and the growth rate of reaction layer Ⅱ were obviously larger than those of reaction layer Ⅰ. There was no change in the type of the interfacial structure mentioned above within bonding time from 0.9 to \{7.2\} ks.
