摘要
对CPK、SPC和PPM三项评价IC芯片质量和可靠性的关键技术进行了研究。使用这三项技术,实际评价了芯片制造工艺中的氧化工艺。实践证明,这三项技术在工艺生产能力评估、工艺过程控制和失效分析等方面具有广阔的应用前景,特别是在工艺过程中对特殊工艺的评估。
Three key technologies,CPK,SPC and PPM,for evaluating quality and reliability of IC chips were studied.Oxidation process in IC fabrication was evaluated using these technologies.It has been demonstrated that the three technologies can find applications in process capability evaluation,statistical process control,failure analysis and so on.It is especially suitable for evaluating special processes in IC fabrication.
出处
《微电子学》
CAS
CSCD
北大核心
2011年第4期617-620,共4页
Microelectronics
基金
国防基础科研基金资助项目(B1120060466)
国家重大基础研究基金资助项目(Y61398)
关键词
半导体工艺
可靠性
统计过程控制
Semiconductor process
Reliability
Statistical process control
