期刊文献+
任意字段
题名或关键词
题名
关键词
文摘
作者
第一作者
机构
刊名
分类号
参考文献
作者简介
基金资助
栏目信息

基于制作COF精细线路的液态光致抗蚀液性能研究 被引量：1

Study on properties of Liquid Photoresist for manufacturing COF fine lines
下载PDF
导出
摘要 卷对卷丝网印刷机在超薄挠性覆铜箔层压板上丝网印刷液态光致抗蚀液,实现COF精细线路的制作。研究了液态光致抗蚀液的感光性能与分辨率力等性能,考察了制作出COF的线路效果。实验结果表明,液态光致抗蚀液网印的针孔数随厚度的减小而增加,液态光致抗蚀剂曝光级数随曝光能量的变化趋势与干膜是一致的,11μm厚液态光致抗蚀剂分辨的最小线路宽达到25μm,满足COF精细线路制作的要求。 Liquid photoresist was printed on ultra thin and flexible copper-clad laminates by Roll to Roll silk-screen printing machine.Photosensitive property and resolution of liquid photoresist were studied and effects of COF fine lines were investigated.The results indicate pin holes may increase with diminishing thickness of liquid photoresist,the relationship of exposing level and light Intensity of liquid photoresist is corresponded with that of dry film and the maximal resolution of fine lines is caught up to 25 μm with liquid photoresist in thickness of 11 μm.Liquid photoresist shows good agreement with manufacturing COF with fine lines.
作者 莫芸绮 王淞 毛继美 何为 陈苑明
机构地区 珠海元盛电子科技股份有限公司 电子科技大学微电子与固体电子学院应用化学系
出处 《印制电路信息》 2011年第8期31-34,共4页 Printed Circuit Information
关键词 液态光致抗蚀液 丝网印刷 分辨率 芯片直接装在挠性板上或芯片直接装在薄膜上 精细线路 Liquid photoresist silk-screen printing resolution COF fine lines
分类号 TN41 [电子电信—微电子学与固体电子学]
  • 相关文献

参考文献11

  • 1C. Q. Cui, K. Pun. Cu Fully Filled Ultra-Fine Blind Via on Flexible Substrate for High Density Interconnect[C]. International Conference on Electronic Manufacturing Technology, 2006:13-19;.
  • 2D. Liu, S. Yeh, C. Kao, et al. An experimental and numerical investigation into the effects of the chip- on-film (COF) processing parameters on the Au-Sn bonding temperature [J]. Soldering & Surface Mount Technology, 2010,Vol.22, No. 4:31-41.
  • 3M. Vernackt. System, method and article of manufacture for improved laser direct imaging a printed circuit board utilizing a mode locked laser and scophony operation[P]. US Patent: 6560248 B1, 2003-05-06.
  • 4陈兵,黄志东.直接成像技术在PCB中的应用[J].电子工艺技术,2002,23(2):63-65. 被引量：3
  • 5P. Jalonen, A. Tuominen. The applicability of electrodeposited photoresists in producing ultra-fine lines using sputtered seeding layers[J]. Circuit World, 2002, 28(2): 11-13.
  • 6吴建华,杨成龙,郭敬涛.新型液态光致抗蚀剂[J].印染,2005,31(5):29-31. 被引量：1
  • 7谢华,曹友新.液态光致抗蚀剂在内层板生产中的应用[C].第六届全国印制电路学术年会论文汇编.上海:中国电子学会,2000:78-84.
  • 8李学明,李子福.液态光致抗蚀剂-在PCB制造工艺中的应用[C].中国辐射固化研讨会论文集.重庆:中国感光学会,2004:24-29.
  • 9V. Gostilo, D. Gryaznov, I. Lisjutin. Technological limitations and processing-generated defects at the development of pixel and strip arrays[J]. Nuclear Instruments and Methods in Physics Research Section A: Accelerators, Spectrometers, Detectors and Associated Equipment, 2002, 487(1-2): 13-18.
  • 10张青,阙民辉.液态光致抗蚀剂浅析[J].印制电路信息,2002(8):26-29. 被引量：1

二级参考文献11

  • 1付川.正性光致抗蚀剂的合成与应用[J].重庆三峡学院学报,2001,17(2):93-94. 被引量：2
  • 2[1]Arvind Partha,Zemel M.A Comparison of PCB Imaging Technologies[C].IPC Printed Circuits Expo 2001 Proceedings of the Technical Conference,2001. Anaheim CA USA.S15-2-1.
  • 3[2]Itzhak Taff.Direct Image - Major Trends and Impact on PCB Manufacturers[C].IPC Printed Circuits Expo 2001 Proceedings of the Technical Conference,2001.Anaheim CA USA.S04-1-1.
  • 4[3]David E Stone.Laser Direct Imaging-A cost Effective Choice[C].IPC Printed Circuits Expo 2001 Proceedings of the Technical Conference,2001.Anaheim CA USA.S18-3-1.
  • 5[4]Shavi Spinzi.Direct Imaging Implementation: Real World Case Studies[C].TPCA2000 Forum Proceedings,2000.Taipei.90-95.
  • 6[5]Gunther Enne.Laser Direct Imaging for Precise Positioning of Circuitry With HDI/Micro Vias and SBU Technologies[C].TPCA2000 Forum Proceedings,2000.377-384.
  • 7[6]Christophe Vaucher.New Technologies in Advanced PCB Manufacture[J].Printed Circuit Europe, 2001,23(1):20-22.
  • 8李晓春.纺织品印花[M].北京:中国纺织出版社2002,..
  • 9孙奕明,何卫波.如何减少图形转移造成的报废[J].印制电路信息,2001(3):29-31. 被引量：1
  • 10白蓉生.湿膜(液态光致抗蚀剂)辊涂法之现况[J].印制电路信息,2001(4):11-16. 被引量：4

共引文献2

同被引文献17

  • 1林金堵;梁志立;陈培良.现在印制电路先进技术[M]上海:中国印制电路行业协会,201247-55.
  • 2小林;蔡积庆;龚永林.积层印制电路板[M]上海:中国印制电路行业协会,200335-41.
  • 3JALONEN P,TUOMINEN A. The applicability of electrodeposited photo resists in producing ultra-fine lines using sputtered seeding layers[J].{H}CIRCUIT WORLD,2002,(2):11-13.
  • 4田玲;李志东.蚀刻喷淋压力对精细线路制作的影响[A]深圳,2008.
  • 5SHIMIZU K,KOMATSU K,TANAKA Y. Controlled surface etching process for fine line/space circuits[A].USA:IEEE,2002.
  • 6WATANABE R,KIM H W. New circuit formation technology for high density PWB[A].USA:Curran Associates Inc,2005.
  • 7WATANABE R. Samsung's big idea[J].Circuitree,2005,(7):12-16.
  • 8KOBAYASHI K. Fabrication of fine line patterns for advanced build-up package[J].Int Conf Electron Packg,2001,(4):393-398.
  • 9YUNG K C,YUE T M,CHART K C. The effects of pulse plating parameters on copper plating distribution of micro via in PCB manufacture[J].IEEE Trans Electron Packg Manuf,2003,(2):106-109.
  • 10CHESKIS H P,CHEN S F,BRENNEMAN W L. Ultra thin copper foil for HDI applications[J].Circuitree,2004,(11):10-19.

引证文献1

二级引证文献12

印制电路信息
2011年 第8期

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部