SMD晶片自动上片系统的设计与实现

Design and Implementation of Automatic SMD Chip Loading System

在SMD石英晶体器件生产流程中，需要将每一片石英晶片装到特制的镀膜板上，称作上片工序。由于该工序对操作精度要求极高，通过人工方式已无法完成工作要求。本文讨论的SMD晶片自动上片系统，针对该难题提供了一种解决方案，实现了对SMD石英晶片的高速、高精度的全自动上片功能，满足了SMD石英器件生产企业的使用需求。

During the production process of SMD crystal devices, each crystal chip should be loaded to a specific coated plate called chip-loading procedure. It can not be done by manual operation due to the high demand of operating accuracy. This paper proposes a solution to re- alize the high speed, high accuracy and full automatic chip loading function of SMD crys-tal chip to satisfy the requirement of SMD crystal device manufacturers.