摘要
This paper describes a technique that can obtain ternary Sn-Ag-In solder bumps with fine pitch and homogenous composition distribution.The main feature of this process is that tin-silver and indium are electroplated on copper under bump metallization（UBM） in sequence.After an accurate reflow process,Sn_（1.8）Ag_（9.4）In solder bumps are obtained.It is found that the intermetallic compounds（IMCs） between Sn-Ag-In solder and Cu grow with the reflow time,which results in an increase in Ag concentration in the solder area.So during solidification, more Ag_2In nucleates and strengthens the solder.
This paper describes a technique that can obtain ternary Sn-Ag-In solder bumps with fine pitch and homogenous composition distribution.The main feature of this process is that tin-silver and indium are electroplated on copper under bump metallization（UBM） in sequence.After an accurate reflow process,Sn_（1.8）Ag_（9.4）In solder bumps are obtained.It is found that the intermetallic compounds（IMCs） between Sn-Ag-In solder and Cu grow with the reflow time,which results in an increase in Ag concentration in the solder area.So during solidification, more Ag_2In nucleates and strengthens the solder.
