摘要
The silicon wafer accounts nearly half of the photovoltaic module cost, and hence on this issue an important opportunity remains for further decreasing the cost of photovoltaics. It is well known that ribbon technology has a large potential for costs reduction by avoiding kerr losses since no saw processes are used, preventing material losses up to 50% of the initial feedstock. On the other hand we ought to ask ourselves why we should use solid silicon feedstock, which has already undergone a crystallization process with high energy content to recrystallize it again in a crucible, spending even more energy, when we can go directly from the gaseous feedstock source to the final ribbon. The cost cutting strategy that supports the Silicon over Dust Substrate （SDS） technology, here presented, is based on the belief that ribbon technology and the silicon feedstock issue will play an important role on ＂wafer＂ cost reduction.
