摘要
分别采用62Sn36Pb2Ag钎料和63Sn37Pb共晶钎料焊接AgCu合金块和CuBe合金片进行试验,对比分析两种钎料形成的焊缝性能和显微组织结构,阐述了62Sn36Pb2Ag钎料中Ag元素的存在对AgCu/SnPbAg/CuBe焊缝性能的影响机制.结果表明,62Sn36Pb2Ag钎料中的Ag元素对于润湿铺展状态的改变有利于控制焊缝内部气孔含量,弥散分布于焊缝内部的Ag3Sn颗粒状结构能够有效钉扎位错而提高焊缝强度,钎焊温度下银含量接近饱和的状态有效抑制了界面附近脆性Ag3Sn相的局部富集,优化了焊缝显微组织.
62Sn36Pb2Ag solder and 63Sn37Pb eutectic solder were adopted to join the AgCu alloy bulk and CuBe alloy sheet.The mechanical properties and the relative microstructure for both solder joints were compared and analyzed by the experimental studies.The influence mechanism of Ag element in 62Sn36Pb2Ag on the properties of the AgCu/SnPbAg/CuBe solder joint was elaborated in detail accordingly.The results show that the Ag element in the solder changes the wetting behavior and benefits the less voids,the dispersed distribution of the Ag3Sn particles contributes the dislocation clinching and results in the higher solder joint strength,and the nearly saturated state of Ag content in the solder joint under the soldering temperature prevents the brittle Ag3Sn phase enriching near the interface and gives the ideal microstructure of the solder joint.
出处
《焊接学报》
EI
CAS
CSCD
北大核心
2011年第8期65-68,116,共4页
Transactions of The China Welding Institution
基金
航天科技集团公司重大工艺基金资助项目(ZDGY2010-14)
关键词
锡铅银钎料
银基合金
钎焊
62Sn36Pb2Ag solder
Ag-based alloy
soldering
