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小型LTCC巴伦的设计 被引量:5

Design of a miniaturized LTCC balun
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摘要 提出了一种基于Marchand巴伦结构的小型化半集总参数巴伦。通过加载端电容和谐振电容减小巴伦耦合线电长度,LTCC多层布线的实现方式进一步减小了巴伦的实际体积。采用奇偶模分析方法对该结构进行分析,给出了设计曲线,采用A6-M材料仿真并制作出尺寸为2.5mm×2.0mm×1.0mm的巴伦。测得在2.7~2.9GHz,S11小于-15dB,幅度不平衡度小于±0.5dB,相位不平衡度小于±10°。最后分析了仿真值和实测值的差异的原因。 A miniaturized semi-lumped balun based on Marchand balun was proposed. Loading terminal capacitors and resonant capacitors were employed in this structure to reduce the electric length of the coupling line. The size of the balun was further reduced due to the multilayer structure based on LTCC technology. The proposed structure was analyzed in detail using even-odd mode analysis method and some design curves were achieved. The balun with the size of 2.5 mm×2.0 mm×l.0 mm was simulated and fabricated by using the A6-M material. The results show that parameters of the fabricated balun are the amplitude imbalance of=±0.5 dB and the phase imbalance of±10°, with over the S11 of-15 dB in 2.7-2.9 GHz. The reason for variance between the simulation value and the test value was analyzed.
出处 《电子元件与材料》 CAS CSCD 北大核心 2011年第9期53-56,共4页 Electronic Components And Materials
关键词 巴伦 低温共烧陶瓷 小型化 加载电容 balun low temperature co-fired ceramic miniaturization loading capacitors
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参考文献14

  • 1何中伟.LTCC工艺技术的重点发展与应用[J].集成电路通讯,2008,26(2):1-9. 被引量:25
  • 2LEW D W, PARK J S, AHN D, et al. A design of the ceramic chip balun using the multilayer configuration [J]. IEEE Trans MTT, 2001, 49(1): 220-224.
  • 3SCHWINDT R, NGUYEN C. A CAD procedure for the double-layer broadside-coupled Marchand balun [C]//1994 IEEE MTT-S Int Dig. San Diego, USA: IEEE, 1994.
  • 4ROGERS J, BHATIA R. A 6 to 20 OHz planar balun using a Wilkinson divider and Lange couplers [C]// 1991 IEEE MTT-S lnt Dig. Boston, USA: IEEE, 1991.
  • 5FUJIKI Y, MANDAI H, MORIKAWA T. Chip type spiral broadside coupled directional couplers and baluns using low temperature co-fired ceramic [C]// 1999 IEEE Electronic Components and Technology Conference. San Diego, USA: IEEE, 1999.
  • 6TANG C W, SHEEN J W, CHANG C Y. Chip-type LTCC-MLC baluns using the stepped impedance method [J]. IEEE Trans MTT, 2001, 49: 2342-2349.
  • 7CHONGCHEAWCHAMNAN M C Y, ROBERTSON I D. Analysis and design of a high-performance planar Marchand balun [C]//2002 IEEE MTT-S Dig. Washington, USA: IEEE, 2002.
  • 8TANG C W, CHANG C Y. A semi-lumped balun fabricated by low temperature co-fired ceramic [C]//2002 IEEE MTT-S Dig. Washington, USA: IEEE, 2002.
  • 9吴国安,徐勤芬,汤清华,刘浩斌.基于LTCC技术的蓝牙巴伦设计[J].微波学报,2007,23(4):55-57. 被引量:18
  • 10TANG C W, CHANG C Y. LTCC-MLC chip-type balun realised by LC resonance method [J]. Electron Lett, 2002, 38:519-520.

二级参考文献6

  • 1Lim H A,Leong M S,Ooi B L,Chew S T.A new method of designing marchand balun for multilayer applications.APMC 2001,Taiwan,2001.
  • 2Rogers J,Bhatia R.A 6 to 20 GHz planar balun using a Wilkinson divider and Lange couplers.1991 IEEE MTT-S Int Dig,1991.865-868.
  • 3Tang C W,Sheen J W,Chang C Y.Chip-type LTCC-MLC baluns using stepped impedance method.IEEE Trans Microwave Theory Tech,2001,49(12):2342-2349.
  • 4Fujiki Y,Mandai H,Morikawa Takehiko.Chip type spiral broadside coupled directional couplers and baluns using low temperature co-fired ceramic.1999 IEEE Electronic Components and Technology Conference,1999.105-1 10.
  • 5HarufumiMandai,et al.Characterris tics of Ceramic Multilayer Substrates and Apprecation for RF Circuits.MWE'93,327-330.
  • 6Tang Ching-wen,Chang Chi-Yang.A semi-lumped Balun fabricated by low temperature co-fired ceramic.2002 IEEE MTT-S Int Dig,2002.2201-2203.

共引文献35

同被引文献18

  • 1吴国安,徐勤芬,汤清华,刘浩斌.基于LTCC技术的蓝牙巴伦设计[J].微波学报,2007,23(4):55-57. 被引量:18
  • 2Lap K. Yeung, Ke-Li Wu,Yuanxun E. Wang. Low-Temperature Cofired Ceramic LC Filters for RF Applications [J].Microwave Magazine, IEEE,2008,9(5):118-128.
  • 3Kwang Lim Choi, Nanju Na, Swanfinathan.Characterization of embedded passives using macromodels in LTCC technology [J].Compo- nents, Packaging, and Manufacturing Technology, Part B'. Advanced Pack- aging,IEEE, 1998,21 (3) :258 -268.
  • 4Varadan, V. V.; Kim, I. K.Fabrication of 3-D Metamaterials Us- ing LTCC Techniques for High-Frequency Applications [J].Components, Packaging and Manufacturing Technology,IEEE,2012,99:1.
  • 5CALOZ C, ITOH T. Electromagnetic metamaterials transmission line theory and microwave applications[M]. Piscataway, NJ: Wiley-IEEE Press, 2005 : 1-260.
  • 6LIN I H, VINCENTIS M D, CALOZ C, et al. Arbitrary dual-band components using composite right/left-handed transmission lines [J]. IEEE Transactions on Microwave Theory and Techniques, 2004,52 (4) : 1142-1149.
  • 7柳锐锋,甘连仓,梁婷.仿真暗室天线近场测试研究[J].电子测量与技术,2012,35(12):38-40.
  • 8刘宁民,邓晖.S波段宽频带微带正交模变换器[J].电子测量技术,2008,31(4):65-67. 被引量:1
  • 9何中伟.LTCC工艺技术的重点发展与应用[J].集成电路通讯,2008,26(2):1-9. 被引量:25
  • 10张培,程光伟.新型传输线CRLH-TL的研究[J].电子科技,2011,24(1):86-88. 被引量:1

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