摘要
引起封装打线失效的原因有很多,首先是封装打线工艺的影响,但是芯片自身质量也有很大的关系。文章主要考虑芯片压焊块结构的设计因素,诸如压焊块区域膜层的组成、其上的孔阵列尺寸、铝层厚度等,对打线效果的好坏(脱铝、打穿)都有很密切的关系。文中对这几个因素进行研究,如压焊块上开孔的尺寸对打线粘附力的影响,不同clear ratio与打线失效的关系以及失效机理上的解释,打铜线对压焊块金属层的要求以及一种新式的局部加厚压焊块上的金属层工艺,为改善打线失效情况提供了一些参考方向。
A lot of factors can lead to wire bond fail.Firstly,process parameter of wire bond is important very much.Secondly,quality of IC is also essential for wire bond.Especially,the design for pad,such as the kinds of films,layout of contact,the thickness of metal layer,have great influence over effect of wire bond.Contact size and clear ratio will impact on force of adhesion.Fail model be analyzed.The influence of thickness of metal and how to manufacture thick metal been mentioned.All of this maybe is good instance for wire bond.
出处
《电子与封装》
2011年第8期1-3,14,共4页
Electronics & Packaging
