摘要
为实现胶黏剂微波固化温度的精确测控,基于PIC16F877A单片机和红外测温传感器OPTC设计了胶黏剂微波固化温度的测控系统及其C语言驱动程序。红外测温信号由单片机自带10位ADC模块进行采集,微波功率控制所需PWM方波由调节电位器所得模拟输入电压的A/D转换值控制。Proteus仿真结果表明,系统的软硬件设计正确。
In order to full fill the accurate measurement and control, the measurement and control system of glue solidification temperature and its C language driving program were designed on the basis of PIC16F877A MCU and infrared temperature sensor OPTCS. Infrared temperature signal was collected by MCU 10 bit ADC module. Micro--wave power was adjusted by PWM rectangle wave which was obtained by the digit control from A/D transformation. Proteus simulation result shows that the system＇s software and hardware design is right.
出处
《新技术新工艺》
2011年第8期106-108,共3页
New Technology & New Process
