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集成电路可测性设计IO复用方法 被引量:9

Methods of DFT IO Multiplexing
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摘要 超大规模集成电路特征尺寸逐步缩小的发展过程中,芯片面积是制约芯片成本的最重要因素之一,也是直接影响半导体产品市场竞争力的最重要因素之一。本文介绍了将所有可测性设计(DFT)的输入输出端口(IO)与各种类型的正常功能工作模式的IO复用的方法,从而达到减少IO并最终减小芯片面积的目的。介绍了输入信号和输出信号分别在单向端口IO和双向端口IO中复用的方法。然后,以一款经过0.18μm逻辑工艺流片验证的flash存储器控制芯片为例,对比了采用IO复用方法前后芯片的利用率和面积,证明了方案的可行性和有效性。 With the development of very large scale integration,whose feature si ze is shrinking gradually,chip area has become one of the most important factor s to affect the cost of one die,and finally affect the competitiveness of one s emiconductor product.The structures of multiplexing with all design for test(D FT) input/output ports(IO) and all types of normal working function IO were desc ribed to decrease the quantity of IO and ultimately achieve the goal of reducing area of the chip.The IO multiplexing methods of input signals and output signals in in put/output IO and bi-directional IO were introduced respectively.Takes a flash memory controller under 0.18 μm process for example,compare core utiliza tion and chip area before and after optimization by IO multiplexing.It proved t he feasibility and efficiency of scheme put forward was good.
出处 《半导体技术》 CAS CSCD 北大核心 2011年第9期705-709,共5页 Semiconductor Technology
基金 北京工业大学博士科研启动基金项目(X0000190110)
关键词 面积 输入输出端口 复用 可测性设计 测试模式选择 area input/output parts(IO) multiplexing design for test(DFT) test-mode select
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参考文献5

  • 1成立.数字电子技术[M].北京:机械工业出版社,2003..
  • 2BURNS S G,BOND P R.电子电路原理(下册)[M].黄汝激译.2版.北京:机械工业出版社,2001.
  • 3张弘,李玉山.SoC测试结构复用技术研究[J].半导体技术,2004,29(2):48-50. 被引量:3
  • 4RAJSUMAN R. Design and test of large embedded memories: an overview [ J]. IEEE Design and Test of Computers, 2001, 18 (3): 16-27.
  • 5RAJSUMAN R. System-on-a-chip: design and test [ M ] . Artech House Inc, 2000 : 157 - 192.

二级参考文献5

  • 1[1]MCLAURIN T,GHOSH S.ETM10 incorporates hardware segment of IEEE PI500[J]. IEEE Design & Test of Computers , 2002 5(19): 6-11.
  • 2[2]IEEE Computer Society. IEEE Standard Test Access Port and Boundary-Scan Architecture[M]. NewYork:IEEE, 1993.
  • 3[3]MARINISSEN E J,et al. A Structured and Scalable Mechanism for Test Access to Embedded Reusable Cores[A]ITC' 98[C]. USA: Washington DC, 1998,69-78.
  • 4[4]JENNIC.DFT-IP Reuse & SoC[DB/OL]. http://www.jennic.com , 2002-5-5.
  • 5[5]VARMA P,BHATIA B. A Structured Test Re-use Methodology for Core-based System Chips[A]. ITC'98 [C]. USA: Washington DC, 1998,294-302.

共引文献7

同被引文献33

  • 1雷加,晏筱薇.Flash存储器的内建自测试设计[J].微计算机信息,2008,24(5):296-297. 被引量:4
  • 2鲍胜荣,吴旭凡,钟锐.一款嵌入式芯片总线仲裁器的设计和评估[J].电子工程师,2005,31(1):19-22. 被引量:5
  • 3鉴海防,王占和,李印增,张昭勇.SoC嵌入式flash存储器的内建自测试设计[J].微电子学与计算机,2005,22(4):87-91. 被引量:8
  • 4王力纬,曹阳,朱小虎,李晓辉.多端口存储器控制器IP核的设计与实现[J].武汉大学学报(理学版),2007,53(5):617-621. 被引量:5
  • 5International SEMATECH . The International Tech-nology Roadmap for Semiconductors[C] // proceedingsof the 20th Anniversary Symposium Tokyo, Japan:IEEE, 2005,.
  • 6CHOU K Y, CHEN M Y. Active circuits under wire bonding I/O pads in 0. 13 /zm eight-level Cu metal, FSG low-K inter-metal dielectric CMOS technology [J]. Elec Dev Lett, 2001, 22(10): 466-468.
  • 7KER M D, PENG J J, JIANG H C. Active device under bond pad to save I/O layout for high-pin-count SOC [C] // Proc 4th Int Syrup Quality Elec Des. 2003 :241-246.
  • 8KANGSM,LEBLEBICIY.CMOS数字集成电路--分析与设计[M].王志功,等,译.北京:电子工业出版社,2005:364-367.
  • 9KAFFASHIAN M H, LOTFI R, MAFINEZHADAND K, et al. An optimization method for NBTI-aware design of domino logic circuits in nano-scale CMOS [J]. IEICE Elec Express, 2011, 8(17).- 1406-1411.
  • 10HAM1D M M, KAUSHIK R. Diode-footed domino: a leakage-tolerant high fan-in dynamic circuit design style [J]. IEEE Trans Circ Syst, 2004, 51(3): 495- 503.

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