1,10-菲绕啉对织物化学镀铜的影响

The Effect of 1,10-Phenanthroline on Electroless Copper Plating on the Fabric

研究1,10-菲绕啉对织物化学镀铜沉积速率、镀层成分、微观结构、表面形貌和表面电阻的影响。结果表明:添加适量的1,10-菲绕啉可以有效提高沉积速率,表面电阻明显降低,使镀层变得致密均匀,颜色由棕黑色变成亮铜色。添加1,10-菲绕啉还可使镀层中的铜含量增高,改善镀层微观结构,减小晶粒尺寸,可起到细化晶粒的作用,镀层由原来的(111)晶面择优取向转变为(220)和(311)晶面择优取向。

The influences of 1,10-phenanthroline on the deposit rate,structure,morphology and surface resistance are investigated.It is found that adding an optimum amount of Phenanthroline to the plating solution will not only increase significantly the deposition rate of the copper deposits,but also decrease markedly the surface resistance,while the color of the deposits changes from dark-brown to copper-bright with improved uniformity.The content of Cu in the deposits also increases slightly and the microstructure is improved with the addition of Phenanthroline.Smaller crystallite size and preferred orientation of（220） and（311） plane are obtained by the addition of Phenanthroline to the bath.