摘要
分析了微波外壳产生失效的主要原因,针对其在制备过程中的关键工艺以及技术难点展开讨论。分别论述了影响外壳可靠性的各个关键因素以及影响机理,包括瓷件尺寸精度和平整度、金属化强度与钎焊技术等,结合现有的工艺情况,分别提出相应的控制措施,并取得良好的效果。
The dominating reason for microwave package failure was discussed in this paper.The key technical difficulty in preparation process was studied.Various factors affecting the reliability of package and their mechanism were discussed,including the dimension precision and the flatness of ceramic,the strength of metal and ceramic hang together,and sealing technology.Considering the process in practice,the corresponding resolving techniques making excellent effect were employed in this paper.
出处
《固体电子学研究与进展》
CAS
CSCD
北大核心
2011年第4期383-386,共4页
Research & Progress of SSE
关键词
微波外壳
可靠性
封接强度
气密性
microwave package
reliability
strength of sealing
hermetic performance
