期刊文献+

固溶态Cu-1.5Ni-0.6Si合金时效析出动力学研究 被引量:1

Study on Dynamics of Cu-1.5Ni-0.6Si Alloy As-solutioned During Aging Precipitation
下载PDF
导出
摘要 研究了时效温度和时间对Cu-1.5Ni-0.6Si合金性能的影响。通过对固溶态Cu-1.5Ni-0.6Si合金450℃时效过程中的电导率的变化,根据电导率与新相的转变量之间的关系计算时效过程中新相的变化率。根据Avrami经验公式确定该温度下时效的相变动力学方程及电导率方程。实验结果表明,时效析出为Cu-1.5Ni-0.6Si合金的主要强化手段。Cu-1.5Ni-0.6Si固溶后经不同温度时效后,时效初期硬度和电导率快速上升,随后硬度到达峰值后缓慢下降,而电导率继续上升。由该电导率方程所得的计算值能较好地与实验值相符,为该合金的生产工艺的制定提供参考依据。 The effects of aging temperature and aging time on properties of Cu-1.5Ni-0.6Si alloy were studied. The transformation ratio of new phase in Cu-1.5Ni-0.6Si alloy was calculated when aging at 450℃ by measuring the electrical conductivity and the relation between the electrical conductivity and the quantity of new phase. The equation of the phase transformation kinetics and electrical conductivity equation was determined according to Avrami empirical formula. The results show that aging precipitation is the main strengthening methods for the Cu-1.5Ni-0.6Si alloy. The initial hardness and electrical conductivity increases rapidly after different solution-aging processes. Hardness declines slowly then reachs the peak, while the electrical conductivity continues to rise. The calculated values of electrical conductivity well consistent with those of experiment, which can provide reference on the alloy of production process.
出处 《热加工工艺》 CSCD 北大核心 2011年第16期173-176,共4页 Hot Working Technology
关键词 Cu-1.5Ni-0.6Si合金 时效 电导率 相变动力学 相变方程 Cu-1.5Ni-0.6Si alloy aging electrical conductivity transformation kinetics equations of phase change
  • 相关文献

参考文献13

二级参考文献45

  • 1赵冬梅,董企铭,刘平,金志浩,康布熙.高强高导铜合金合金化机理[J].中国有色金属学报,2001,11(z2):21-24. 被引量:124
  • 2梁玉平,刘茂森.Cu-Fe系原位复合线材[J].上海金属(有色分册),1993,14(3):1-6. 被引量:2
  • 3李红霞,田保红,林阳明,李士凯,刘平.内氧化法制备Al_2O_3/Cu复合材料的再结晶行为[J].稀有金属材料与工程,2005,34(7):1039-1042. 被引量:9
  • 4王深强,陈志强,彭德林,安阁英.高强高导铜合金的研究概述[J].材料工程,1995,23(7):3-6. 被引量:69
  • 5二冢练成.Development of copper alloy for leadframe[J].伸铜技术研究会志,1997,36(1):25-32.
  • 6曹育文.引线框架用高强高导铜合金研究[M].北京:清华大学,1999.57-66.
  • 7铃木竹四.The characteristics and processes in Cu-Ni-Si alloy heat treatment[J].伸铜技术研究会志,1994,33(1):152-160.
  • 8[1]Rensei F.Rensei Futatsuka development of copper alloy for leadframe [J].Journal of the Japan Copper and Brass Research Association,1997,36: 25-32.
  • 9[2]Naotsugu I.Behavor of pricipitation and recrystallization affect upon texture of Cu-Cr-Zr alloy [J].Journal of the Japan Copper and Brass Research Association,1993,32: 115-121.
  • 10[3]Motohisa M.High-strength and high-conductivity alloy KLF201 [J].Journal of the Japan Copper and Brass Research Association,1988,27: 93-98.

共引文献308

同被引文献4

引证文献1

二级引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部