期刊文献+

膨胀压差法扩散连接残余应力数值模拟 被引量:1

Numerical Simulation on Residual Stress in Diffusion Bonding Joints by Difference of Expansion Stress
下载PDF
导出
摘要 采用有限元分析软件ANSYS对Ti-6Al-4V与ZQSn10-10组合筒形件扩散连接接头残余应力的大小及分布进行了数值模拟。结果表明,有害的较大的残余应力出现在连接界面金属间化合物混合层上以及靠近Ti-6Al-4V母材侧的狭小区域;沿着连接界面轴向上的应力分布均匀,但邻近上下表面由于边缘效应而产生较大的应力集中。 The residual stress in the diffusion bonding joints of Ti-6Al-4V and ZQSn10-10 sleeve structure was simulated by ANSYS.The results indicat that the residual stress which is harmful to the joint,appears in the narrow area adjacent to Ti-6Al-4V side where intermetallic compounds form;and the stress uniformly distributes along the welding axis.But the stress concentrates on the upper and down surfaces,because of brinkmanship.
出处 《热加工工艺》 CSCD 北大核心 2011年第15期176-177,181,共3页 Hot Working Technology
关键词 膨胀压差 扩散连接 残余应力 数值模拟 difference of linear expansion diffusion bonding residual stress numerical simulation
  • 相关文献

参考文献3

  • 1He Peng,Zhang Jiuhai,Zhou Ronglin,et a/. Diffusion Bonding Technology of a Titanium Alloy to a Stainless Steel Web With an Ni Interlayer [J]. Materials Characterization, 1999,43 (5): 287-292.
  • 2Yu H Y, Sanday S C,Rath B B. Residual stresses in ceramic-interlayer-metal joints [J]. Journal of the America Ceramic Society, 1993,76(7): 1661-1664.
  • 3Kovalev Serguei, Miranzo Pilar,Osendi Maria Isabel. Finite element simulation of thermal residual stress in joining ceramics with thin metal interlayer [J]. Journal of the American Ceramic Society, 1998,81(9) :2342-2348.

同被引文献4

  • 1Kolukisa Sedat, et al. Transient liquid phase (tip) diffusionbonding ofTi45Ni 49Cu6 P/M components using Cu interlayer [J].International Journal of Advanced Manufacturing Technology,2009,44(7-8):695-699.
  • 2Kundu S, Anand G, Chatteijee S. Diffusion bonding of 17-4precipitation hardening stainless stee! to Ti alloy with and withoutNi alloy interlayer : interface microstructure and mechanicalproperties [J]. Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science, 2012: 1-16.
  • 3Guo Wei, Zhao Xihua, Feng Jicai. Technological studies ondiffusion bonding of Ti-6A1-4V/Cu/QA110-3-1.5 [J]. MaterialScience and Technology, 2009, 17(SUPPL 1) : 73-77.
  • 4黄达,赵熹华,宋敏霞,冯吉才.TC4/ZQSn10-10扩散连接接头残余应力的数值模拟[J].吉林大学学报(工学版),2007,37(5):1078-1082. 被引量:3

引证文献1

相关作者

内容加载中请稍等...

相关机构

内容加载中请稍等...

相关主题

内容加载中请稍等...

浏览历史

内容加载中请稍等...
;
使用帮助 返回顶部