摘要
对采用胶粘剂密封盖板的CCD器件密封失效现象进行了失效分析,得到了主要的失效原因:水气、胶黏剂的混合以及固化程序,并通过改进措施,使CCD器件的密封合格率得到大幅提升,达到了98%,表明胶封工艺达到了实用化水平。
Main factors causing the package seal failure of charge coupled devices （CCD） were analyzed from three aspects： water vapor, mixing and curing procedures of the adhesive. In this paper, the passing rate of adhesive sealing was greatly improved to be 98% by applying innovative measures, which indicate the practicability of the adhesive sealing process.
出处
《半导体光电》
CAS
CSCD
北大核心
2011年第4期539-542,共4页
Semiconductor Optoelectronics
