摘要
通过对耐电晕聚酰亚胺薄膜绕包扁铜线的烧结工艺的研究,重点对绝缘表面存在气泡的现象进行分析,结果表明:影响耐电晕聚酰亚胺薄膜绕包扁铜线表面气泡的主要因素为烧结温度、绕包张力、绕包角度和压轮距高频感应器出口的距离,可以消除表面气泡的最佳工艺为:绕包角度62°,烧结温度(270±10)℃,绕包张力4.5 kg,压轮距高频感应器出口的距离20 cm以内。
The sintering process of corona-resistant polyimide film for flat copper wire was studied,and the bubble of the insulation surface was especially analyzed.It was found that the main factors which cause the bubble in the film surface are sintering temperature,winding tension,winding angle,and the distance between wheel and high-frequency sensor.The optimum process which can completely eliminate the bubble in the film surface is 62°of winding angle,270±10 ℃ of sintering temperature,4.5 kg of winding tension and within 20 cm of distance between wheel and high-frequency sensor.
出处
《绝缘材料》
CAS
北大核心
2011年第4期20-23,共4页
Insulating Materials
关键词
扁铜线
烧结工艺
气泡
flat copper wire
sintering process
bubble
