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我国金属基覆铜板行业的现状与技术新发展 被引量:6

Status and Development of Metal Base Copper Clad Laminates Industry in China
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摘要 介绍了散热基板的发展背景、市场特点,对发展前景进行了预测,并提出企业如何把握此基板市场扩大的契机等问题。 The development background and market characteristic of heat dissipation laminates were introduced.The development prospect of the CCL was forecasted and then suggestions were proposed for enterprises to grasp the opportunity of the expansion of laminate market.
作者 祝大同
出处 《绝缘材料》 CAS 北大核心 2011年第4期28-31,共4页 Insulating Materials
关键词 金属基覆铜板 印制电路板 散热基板 LED 市场 发展 metal base copper clad laminate printed circuit board heat dissipation laminate LED market development
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