摘要
在优化填料分散方式的基础上,通过在四溴双酚A型环氧固化体系中添加不同类型的无机硅微粉填料制备覆铜板,对比其耐热性和界面性能。结果表明:球型硅微粉填料可以较好地改善与环氧树脂的相容性,提高覆铜板的耐热性。
Based on the optimization of filler dispersion,a copper clad laminate（CCL） was prepared through adding different types of silica to bisphenol A-type epoxy curing system.Then the heat resistance and interfacial properties of the CCL were compared.The results show that spherical silica can improve the product＇s compatibility with epoxy resin and increase the heat resistance of the CCL.
出处
《绝缘材料》
CAS
北大核心
2011年第4期39-42,46,共5页
Insulating Materials
关键词
硅微粉
覆铜板
耐热性
silica powder
copper clad laminate（CCL）
heat resistance
