摘要
为了解高层结构中个子结构之间的相互作用,对刚度沿高度变化的双重和三重弯剪型抗侧力体系在水平荷载作用下的侧移进行有限元分析,提出一串联-并联电路模型来表达各弯剪型子结构之间的相互作用,弯剪型结构的弯曲柔度和剪切柔度被模拟为2个电阻,串联形成串联小电路,多个弯剪型结构并联,被模拟为各个小串联电路并联,流过各个小串联电路的电流是剪力,总电流是总水平剪力,各串联小电路两端电压相等表示各子结构侧移相等.采用这个模型,提出整体结构侧移的一个简单计算方法,与有限元结果对比表明,串并联电路模型计算的侧移有良好的精度,特别是顶部位移的误差很小.
To understand the interaction between substructures in highrise buildings,dual and triple shear-flexural structures with varied rigidities over height were studied by FEM for drift under lateral loads.A series-parallel-circuit model was proposed to describe the interaction among shear-flexural substructures: The shear and the flexural flexibilities of each shear-flexural structure are simulated by electric resistances connected in series,these are connected in parallel to simulate the dual or triple shear-flexural structures inter-connected by slabs and links.The currents and voltages through the subcircuits were equal to the horizontal shear force and deformation of every single structure,and the total current was equal to the horizontal shear force of the whole structure.Based on this circuit model,a simple formula for predicting the horizontal deformation is proposed.Comparison shows that,the accuracy of the proposed model is acceptable,especially in predicting the drift at the top of the structures.
出处
《浙江大学学报(工学版)》
EI
CAS
CSCD
北大核心
2011年第8期1435-1440,共6页
Journal of Zhejiang University:Engineering Science
关键词
多重抗侧力体系
串联-并联电路
位移
shear-flexural structures
series-parallel-connection
horizontal deformation