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Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature 被引量:4

Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature
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摘要 A pure Cu (99.995 wt%) has been subjected to dynamic plastic deformation at cryogenic temperature to a strain of 2.1. Three types of microstructures that are related to dislocation slip, twinning and shear banding have been quantitatively characterized by transmission electron microscopy (TEM) assisted by convergent beam electron diffraction (CBED) analysis. Microstructures originated from dislocation slip inside or outside the shear bands are characterized by low angle boundaries (〈15°) that are spaced in the nanometer scale, whereas most deformation twins are deviated from the perfect ∑3 coincidence (60°/〈111〉) up to the maximum angle of 9°. The quantitative structural characteristics are compared with those in conventionally deformed Cu at low strain rates, and allowed a quantitative analysis of the flow stress-structural parameter relationship. A pure Cu (99.995 wt%) has been subjected to dynamic plastic deformation at cryogenic temperature to a strain of 2.1. Three types of microstructures that are related to dislocation slip, twinning and shear banding have been quantitatively characterized by transmission electron microscopy (TEM) assisted by convergent beam electron diffraction (CBED) analysis. Microstructures originated from dislocation slip inside or outside the shear bands are characterized by low angle boundaries (〈15°) that are spaced in the nanometer scale, whereas most deformation twins are deviated from the perfect ∑3 coincidence (60°/〈111〉) up to the maximum angle of 9°. The quantitative structural characteristics are compared with those in conventionally deformed Cu at low strain rates, and allowed a quantitative analysis of the flow stress-structural parameter relationship.
出处 《Journal of Materials Science & Technology》 SCIE EI CAS CSCD 2011年第8期673-679,共7页 材料科学技术(英文版)
基金 the Danish National Research Foundation and the National Natural Science Foundation of China (Grant No. 50911130230)for the Danish-Chinese center for Nanometals, within which this study was performed sponsored by MOST international S&T project(2010DFB54010), SRF for ROCS, SEM, and the Young Merit Scholar of Institute of Metal Research, Chinese Academy of Science, China
关键词 Quantitative structural characterization CU Dynamic plastic deformation Trans mission electron microscopy Convergent beam electron diffraction Quantitative structural characterization Cu Dynamic plastic deformation Trans mission electron microscopy Convergent beam electron diffraction
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