摘要
本文研制出一种性能优异的适用于Sn1.0Ag0.5Cu焊膏的无卤素松香型助焊剂,用润湿性和腐蚀性作为衡量标准,并按照助焊剂的主要性能指标对这三种配方进行了综合性能评价。
A kind of halogen-free rosin-based flux with good performancewhich fit to Sn1.0Ag0.5Cu solder paste is developed in this paper.Comprehensive performance tests were carried out for the three formulationsaccording to the wetting,corrosion and the main parameters of the flux.
出处
《真空电子技术》
2011年第4期27-30,共4页
Vacuum Electronics
