摘要
研究固溶、变形及时效处理对感应熔炼Cu-1.5Ni-0.34Si合金组织与性能的影响。通过硬度、电导率、光学显微镜(OM)和透射电子显微镜(TEM)等测试手段分析合金性能与组织,得出优化的热处理工艺,为该系合金的实际生产提供参考。结果表明,合金经热轧后在700、800和900℃三个温度下分别固溶1h后,晶粒大小分别约为30、150和300μm。800℃固溶1 h后450℃时效16 h硬度达到峰值181HV,析出相颗粒平均直径约12 nm,继续时效至500 h后粒子平均直径约30 nm。800℃固溶1 h后合金经40%冷轧+450℃时效4 h,显微硬度可达186 HV,相对电导率(IACS)为52%。
The effects of thermomechanical treatments including solid solution, hot rolling and aging on microstmcture and properties of Cu-1.5Ni-0.34Si alloy were studied. The micro-hardness and electrical conductivity of Cu-1.5Ni-0.34Si alloy under different thermomechanical treatment conditions were measured, and the microstructure of alloy was examined by optical microscopy and transmission electron microscopy. The Cu-based alloy was solid solution treated at 700℃, 800 ℃ and 900℃ for 1 h, respectively. The alloy solution treaded at 900℃shows the larger grain size of 300 μm comparing with the grain size of 150μm and 30 pan in solution treated at 800 ℃ and 700℃. The peak strength occurres in sold solution treated at 800℃ for 1 h followed by aging treatment at 450℃ for 16 h, at which point the micro-hardness is 181HV and the average precipitate diameter is 12 nm. When the aging time goes up to 500 h, the average grain diameter is 30 nm. After solid solution treated at 800℃ for 1 h and 40% hot rolling, then aging at 450℃for 4 h, the micro-hardness and related electrical conductivity of the alloy are 186HV and 52% IACS, respectivly.
出处
《粉末冶金材料科学与工程》
EI
2011年第4期531-536,共6页
Materials Science and Engineering of Powder Metallurgy
基金
安徽省科技攻关计划项目(08010201026)
