摘要
研究了时效对Cu-0.15Ag-0.1Fe合金的显微硬度、抗拉强度和电导率的影响。结果表明:随着时效时间的增加和时效温度的升高,Cu-0.15Ag-0.1Fe合金的显微硬度和抗拉强度先急剧增加随后逐渐降低;合金经960℃×1 h固溶,在500℃时效2 h后可获得较好的显微硬度和抗拉强度,分别为124 HV和442 MPa;当时效时间增加到6 h,可获得较高的电导率,达到82.5%IACS。通过透射显微镜分析,该合金中的强化相是γ-Fe粒子,与以前报道的Cu-Fe系合金的析出强化相是α-Fe不同。
Effect of aging treatment on microhardness,tensile strength and electric conductivity of Cu-0.15Ag-0.1Fe alloy was studied.The results show that the microhardness and the tensile strength of Cu-0.15Ag-0.1Fe alloy increased rapidly with increasing the aging time and temperature and then decreased slowly.Higher microhardness and tensile strength can be obtained for the alloy after solution at 960 ℃ for 1 h and aging at 500 ℃for 2 h,the microhardness is 124 HV and the tensile strength is 442 MPa.After aging at 500 ℃for 6 h,the electric conductivity reaches 82.5%IACS.The strengthening phase in the alloy is γ-Fe particle by transmission electron microscopy,which is different from the previous reports that the strengthening phase is α-Fe in Cu-Fe alloys.
出处
《材料热处理学报》
EI
CAS
CSCD
北大核心
2011年第9期110-114,共5页
Transactions of Materials and Heat Treatment
基金
江西理工大学工程研究院创新基金项目(JUST.GCY-2010-02)