摘要
以某高功耗军用加固计算机热设计为实例,介绍了热设计过程中,加固计算机主板芯片到风道这一传导路径热阻计算的具体方法,对比了军用加固计算机采用单、双风道各自的传导热阻。并用IcePak热分析软件对采用单、双风道的加固计算机主板温度分布进行了仿真计算,通过实践证明了双风道散热形式在高功耗加固计算机中的可实施性和优越性。
This article is based on an example of certain high-power legionary reggedized computer thermal design.The method to calculate the thermal resistance between electronic apparatus and duct is gived.It also compares the thermal resistance of legionary reggedized computer with single duct and double ducts.With the software of IcePak,thermal distributing of mainboard,in reggedized computer with single duct or double ducts,is calculated.In practice,it is proved that the using of double ducts for cooling of high-power reggedized computer mainboard is implementary and ascendant.
出处
《机电产品开发与创新》
2011年第5期47-49,共3页
Development & Innovation of Machinery & Electrical Products
关键词
高功耗
加固计算机
双风道
热阻
IcePak
high-power
reggedized computer
double wind-socks
thermal-resistance
IcePak
