摘要
在分析SMD封装型LED产品热学结构的基础上,提出了一种新的大功率LED照明灯具的器件结温估算方法,即通过测量预留在MCPCB上的测温点的温度估算LED结温。并对该方法应用于单颗器件及灯具进行了的实验评估。
This paper puts forward a new method by preserving a micro pad besides the LEDs on MCPCB（Metal-Core Printed Circuit Board）for estimating the junction temperature of power LEDs in luminaires,based on the analysis of thermal structure of SMD LED package.This method is tested by relative experiments involved in both single LED and several LEDs combined.
出处
《中国照明电器》
2011年第9期13-16,共4页
China Light & Lighting
关键词
结温
大功率LED
LED灯具
热阻
junction temperature
high power LED
LED lighting
thermal resistance
