摘要
Cu镀Au腔体是微波器件常用封装载体之一。在目前应用中,Cu镀Au腔体微波器件的气密性封装一直是工程化技术难题,大幅影响了微波器件的可靠性和使用寿命。对基于Cu镀Au腔体的微波器件进行了气密性封装研究,探讨了Cu镀Au腔体实现气密性封装可能的工艺路线。通过比较激光封焊和真空钎焊等传统气密性封装工艺方法,提出了"小孔密封"的全新工艺路径,实现了Cu镀Au腔体气密性封装,为Cu镀Au腔体微波器件气密性封装提供了一种低成本的工程化解决方案。
Gold-plated cupreous shell is one of the most common packaging techniques for microwave devices.Now the encapsulation of gold-plated cupreous shell has become the bottleneck of industrial engineering,and greatly limits the reliability and useful life of microwave devices.The encapsulation technology of gold-plated cupreous shell which is widely used for digital control attenuator is researched.The possible processing approaches have been compared with each other.After the comparison between laser welding and vacuum soldering,the hole encapsulation is proposed as a novel method.The encapsulation of gold-plated cupreous shell is realized by this low-cost engineering technology.
出处
《电子工艺技术》
2011年第5期297-299,302,共4页
Electronics Process Technology
关键词
封装工艺
Cu镀Au腔体
激光封焊
真空钎焊
Encapsulation technology
Gold-plated cupreous shell
Laser welding
Vacuum soldering
