摘要
(上接《电子工艺技术》2011年第4期第A15页)Embedded Active Component(Device)An active device that is inserted or formed between the layers of the primary inter connect substrate.It should have terminals which can connect with the layers of the substrate.
出处
《电子工艺技术》
2011年第5期I0006-I0016,共11页
Electronics Process Technology