封装技术的发展-电力电子器件中的新尺寸

Evolution in packaging technology - Novel dimensions in power electronics

赛米控将银烧结工艺代替了芯片和DBC之间的焊接绑定线,这项新技术的使用将使得生产出体积比最先进系统切实减小30%的逆变器成为可能。这项技术的优势将在具有最佳机械一体化的集成、紧凑型系统中得到最好的展现。

M silver sintering process control instead of the chips and the welding line between DBC bind, the use of the new technology will make produce the most advanced system than volume to reduce 30% of the inverter possible. The advantages of this technique in which has the best integration of machinery, compact system integration to get the best of show.