流动状态与热源简化方式对IGBT水冷板仿真结果的影响

Effects of Flow Regime and Heat Source Simplifications on Simulation Results for Water-Cooling Plate of IGBT

利用层流和湍流模型对比研究了直槽道形式水冷板内部的流动状态,结果表明各槽道的平均流速不一致,不能简单地将槽道内的流动状态定性为层流或湍流。与均布热源方式相比,对IGBT元件精确建模方式得到的水冷板上IGBT元件安装面处的最高温度可高6-9℃。精确建模方式可以获得准确的温度分布和IGBT元件内部的芯片结温,计算结果有利于优化水冷板槽道结构,提高换热效率。

By comparing laminar and turbulent models,the flow regime of water-cooling plate with straight channels was researched;the results showed that the average velocities were different in channels,and it was improper to set the flow regime of all channels with laminar or turbulent.The highest different temperature of IGBT installing place of water-cooling plate would be 6~9 ℃ to IGBT precise model compared with uniform layout heat source.The exact temperature field and junction temperature of IGBT would be got with precise model,which helped optimizing channel structure and improving heat transfer efficiency.